Which statement about bonding is correct?

• A. Bonding minimizes potential differences between metallic parts
• B. Bonding is the same as grounding
• C. Bonding is only used for high-voltage systems
• D. Bonding increases system impedance

Answer: (A)

Bonding keeps metal parts that could become energized at the same electrical potential by tying them together with conductors. This creates an equipotential surface, so the voltage difference between exposed metal items is minimized. That matters because when you touch two or more metal surfaces that might be at different potentials, you won’t feel a dangerous shock or see arcing between them.

It’s important to distinguish bonding from grounding: bonding connects conductive parts to each other to maintain equal potential, while grounding provides a path to earth and a reference point for the system. They work together, but they’re not the same thing. Bonding isn’t limited to high-voltage systems; it’s a safety measure used across many voltage levels to prevent shock and arcing. And bonding doesn’t increase system impedance; it often helps by providing a low-impedance path for fault current, aiding protective devices in tripping promptly.